Deca Technologies and Silicon Storage Technology (SST), a subsidiary of Microchip Technology Inc., have announced a strategic agreement to develop a non-volatile memory (NVM) chiplet package. The collaboration aims to support customer adoption of modular, multi-die systems as chiplet technology gains momentum in the semiconductor industry.
The partnership will combine Deca’s M-Series fan-out and Adaptive Patterning technologies with SST’s SuperFlash embedded flash technology. According to both companies, this bundled offering is designed to help customers design, verify, and commercialize NVM chiplets, offering more flexibility compared to traditional monolithic integration.
The new solution will provide a modular foundation for advanced multi-die architectures by merging SST’s SuperFlash technology with interface logic and physical design elements needed for self-contained chiplets. Deca’s Adaptive Patterning-based redistribution layer (RDL) design rules, simulation flows, test strategies, and manufacturing options through its network of qualified partners are also included.
Deca and SST plan to jointly assist customers from early design stages through qualification and prototype manufacturing. Their goal is to streamline integration processes and speed up design cycles, enabling wider use of heterogeneous integration worldwide.
“Chiplet integration is reshaping how the industry thinks about performance, scalability and time to market,” said Robin Davis, VP of Strategic Engagements & Applications at Deca. “Our partnership with SST empowers customers to develop a chiplet solution that combines different chips, process nodes, sizes and even die from multiple foundries delivering more efficient and cost-effective products.”
Chiplet-based approaches allow designers to move beyond traditional scaling methods by combining different types of integrated circuits within one system. This method can reduce costs by reusing existing intellectual property (IP) blocks and mixing advanced process nodes with legacy technologies.
“As our customers push the boundaries of Moore’s Law, they are expressing greater interest in chiplet-based solutions,” said Mark Reiten, Vice President of Microchip’s licensing business unit. “This partnership aims to deliver a comprehensive package of IP, simulation tools and advanced assembly and engineering services necessary for successful chiplet development and productization.”
Microchip Technology Inc., headquartered in Chandler, Arizona, provides system solutions for various markets including industrial, automotive, consumer electronics, aerospace and defense, communications, and computing sectors. More information can be found on the company’s website: www.microchip.com.
SST specializes in embedded flash technology solutions for consumer electronics as well as industrial applications. It became part of Microchip Technology after being acquired in April 2010. Details about SST’s offerings are available at www.sst.com.
Deca focuses on advanced packaging technologies such as its M-Series fan-out approach and Adaptive Patterning process. Its first-generation technologies have shipped over eight billion units globally into smartphone applications. Further information about Deca can be accessed at www.thinkdeca.com.
Customers interested in these new NVM chiplet solutions are encouraged to contact either company through their respective websites for additional details.
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