Microchip Technology launches DualPack 3 IGBT7 power modules for efficient system integration

Steve Sanghi, Chair of the Board, CEO and President at Microchip Technology - Microchip Technology
Steve Sanghi, Chair of the Board, CEO and President at Microchip Technology - Microchip Technology
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Microchip Technology has announced the release of its new DualPack 3 (DP3) power modules, which incorporate advanced IGBT7 technology. The company stated that these modules are available in six variants with voltage ratings of 1200V and 1700V, supporting high-current applications from 300 to 900A.

According to Microchip, the DP3 modules are designed to reduce power losses by up to 15–20% compared to previous IGBT4 devices and can operate at temperatures as high as 175°C during overload conditions. The modules feature a compact footprint measuring approximately 152 mm × 62 mm × 20 mm and come in a phase-leg configuration, enabling higher power output without requiring multiple modules to be paralleled. This approach is intended to help simplify system design and lower bill of materials costs for customers.

The company highlighted that the new DP3 modules offer enhanced protection and control during high-voltage switching operations. They are targeted at industrial drives, renewable energy systems, traction applications, energy storage, and agricultural vehicles. Additionally, Microchip noted that these modules provide a second-source alternative to industry-standard EconoDUAL packages, offering customers greater flexibility and improved supply chain security.

Leon Gross, corporate vice president of Microchip’s high-reliability and RF business unit, said: “Our new DualPack 3 modules with IGBT7 technology can reduce design complexity and lower system costs while maintaining high performance. To further streamline the design process, our power modules can be integrated as part of a comprehensive system solution alongside Microchip’s microcontrollers, microprocessors, security, connectivity and other components to accelerate development and time to market.”

Microchip emphasized that the DualPack 3 power modules are suited for general-purpose motor drive applications and address issues such as dv/dt challenges, driving complexity, higher conduction losses, and lack of overload capability.

The company offers a broad range of power management products including analog devices, silicon-based solutions, silicon carbide technologies, dsPIC Digital Signal Controllers (DSCs), as well as standard and custom power modules. For more information on their offerings or to purchase the new DP3 modules now available in production quantities, customers can visit www.microchip.com or contact authorized distributors.

Microchip Technology is based in Chandler, Arizona and provides technical support for its products across various sectors including industrial automation, automotive systems, consumer electronics, aerospace and defense industries.



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